Portable electronic device housing having insert molding around antenna

ABSTRACT

Embodiments are described herein in the context of housings for electronic devices. In one embodiment, a housing can make use of an outer member, which can be formed of glass. The outer member can be secured with respect to other portions of the housing for the electronic device. The output member can also be protected at its edges by a protective side member. Still further, one or more antenna can be provided at least partially internal to the protective side member. The electronic devices can be portable and in some cases handheld.

BACKGROUND

Conventionally, portable electronic devices have housings that encasesthe various electrical components of the portable electronic devices.Often, the portable electronic devices have a display arrangement withinthe housing. Many portable electronic devices also have wireless networkcommunication capabilities. For wireless communication via a cellulartelephone network, a portable electronic device operable as a mobilephone includes an antenna for the cellular telephone network. Forwireless data communication using a wireless data network (e.g., 802.11,Bluetooth, etc.), a portable communication device includes an antennafor the wireless data network. Hence, the housing for the portableelectronic device can thus include one or more antenna. Placement of theone or more antenna needs to be isolated from each other (if multipleantenna provided) and also positioned a minimum distance away fromelectrically conductive components. Accordingly, placement of antenna inportable electronic device housings becomes increasingly difficult asthe portable electronic device housings become more compact.

SUMMARY

Embodiments are described herein in the context of a housing for anelectronic device. The housing can make use of an outer member, whichcan be formed of glass. The outer member can be secured with respect toother portions of the housing for the electronic device. The outputmember can also be protected at its edges by a protective side member.Still further, one or more antenna can be provided at least partiallyinternal to the protective side member. The electronic device can beportable and in some cases handheld.

According to some embodiments, an electronic device can have a housing(or enclosure) that includes at least one glass cover and a peripheralstructure formed adjacent the periphery of the glass cover. Theperipheral structure can be secured adjacent to the glass cover with anadhesive and/or mechanical means. One or more antenna can be provided atleast partially internal to the peripheral structure. Advantageously,the one or more antenna are securely positioned, protected and shieldedby the peripheral structure, while also being provided in a spaceefficient manner for the electronic device. The one or more antenna canalso serve to provide structure components that can assist with thesecuring of the peripheral structure to the periphery of the glass coveror other parts of the enclosure.

The invention can be implemented in numerous ways, including as amethod, system, device, or apparatus. Several embodiments of theinvention are discussed below.

As an electronic device enclosure for an electronic device, oneembodiment can, for example, include at least: a glass cover for anouter surface for the electronic device enclosure; at least oneperipheral metal antenna provided adjacent a periphery of the glasscover; and a peripheral side protective surface for the glass cover. Theperipheral side protective surface can be provided adjacent to theperiphery of the glass cover and over at least a portion of the at leastone peripheral metal antenna. The peripheral side protective surface canbe molded about the periphery of the glass cover and molded over atleast a portion of the at least one peripheral metal antenna.

As a method for assembling an electronic device, one embodiment can, forexample, include at least the acts of obtaining a glass member,obtaining a peripheral metal antenna, adhering the peripheral metalantenna to a peripheral portion of the glass member, and molding aperipheral protective side portion adjacent to the peripheral portion ofthe glass member and over at least a portion of the peripheral metalantenna.

As a method for assembling an electronic device, another embodiment can,for example, include at least the acts of obtaining an outer housingmember having a top surface and a bottom surface, where the top surfaceprovides an outer surface for a portion of the electronic device;depositing an adhesive layer around at least select portions of aperiphery of the bottom surface of the outer housing member; adhering aportion of a peripheral metal antenna member to the bottom surface ofthe outer housing member using at least the adhesive layer; and moldinga peripheral protective side portion for the electronic device, theperipheral protective side portion being molded adjacent the peripheryof the outer housing member and over the peripheral metal antenna.

Other aspects and advantages of embodiments of the invention will becomeapparent from the following detailed description taken in conjunctionwith the accompanying drawings which illustrate, by way of example, theprinciples of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1 is a flow diagram of a housing formation process according to oneembodiment of the invention.

FIG. 2A is a cross-sectional view of an electronic device housingaccording to one embodiment.

FIG. 2B is a cross-sectional assembly diagram for the electronic devicehousing shown in FIG. 2A, according to one embodiment.

FIG. 3A is a cross-sectional view of an electronic device housingaccording to another embodiment.

FIG. 3B is a cross-sectional assembly diagram for the electronic devicehousing shown in FIG. 3A, according to one embodiment.

FIG. 4 a flow diagram of a housing formation process according to oneembodiment of the invention.

FIGS. 5A-5D are diagrams illustrating of an outer housing assemblyaccording to one embodiment.

FIGS. 6A-6F are partial cross-sectional views of antenna configurationsaccording to certain embodiments.

FIG. 7 is a cross-sectional view of an electronic device housingaccording to another embodiment.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

Embodiments are described herein in the context of a housing for anelectronic device. The housing can make use of an outer member, whichcan be formed of glass. The outer member can be secured with respect toother portions of the housing for the electronic device. The outputmember can also be protected at its edges by a protective side member.Still further, one or more antenna can be provided at least partiallyinternal to the protective side member. The electronic device can beportable and in some cases handheld.

According to some embodiments, an electronic device can have a housing(or enclosure) that includes at least one glass cover and a peripheralstructure formed adjacent the periphery of the glass cover. Theperipheral structure can be secured adjacent to the glass cover with anadhesive and/or mechanical means. One or more antenna can be provided atleast partially internal to the peripheral structure. Advantageously,the one or more antenna are securely positioned, protected and shieldedby the peripheral structure, while also being provided in a spaceefficient manner for the electronic device. The one or more antenna canalso serve to provide structure components that can assist with thesecuring of the peripheral structure to the periphery of the glass coveror other parts of the enclosure.

The following detailed description is illustrative only, and is notintended to be in any way limiting. Other embodiments will readilysuggest themselves to skilled persons having the benefit of thisdisclosure. Reference will now be made in detail to implementations asillustrated in the accompanying drawings. The same reference indicatorswill generally be used throughout the drawings and the followingdetailed description to refer to the same or like parts. It should beappreciated that the drawings are generally not drawn to scale, and atleast some features of the drawings have been exaggerated for ease ofillustration.

In the interest of clarity, not all of the routine features of theimplementations described herein are shown and described. It will, ofcourse, be appreciated that in the development/design of any such actualimplementation, numerous implementation-specific decisions must be madein order to achieve the developer's/designer's specific goals, such ascompliance with application and business related constraints, and thatthese specific goals will vary from one implementation to another andfrom one developer/designer to another. Moreover, it will be appreciatedthat such a development/design effort might be complex andtime-consuming, but would nevertheless be a routine undertaking ofengineering for those of ordinary skill in the art having the benefit ofthis disclosure.

Embodiments of the invention can relate to apparatus, systems andmethods for providing a housing for an electronic device where thehousing includes at least one glass member. In one example, the glassmember may be an outer surface of an electronic device. The glass membermay for example correspond to a glass cover that helps form part of adisplay area of an electronic device (i.e., situated in front of adisplay either as a separate part or integrated within the display.Alternatively or additionally, the glass member may form a part of thehousing. For example, it may form an outer surface other than in thedisplay area.

The housings described herein are especially suitable for small formfactor electronic devices such as handheld electronic devices (e.g.,mobile phones, media players, personal digital assistants, remotecontrols, etc.). The glass can be thin in these small form factorembodiments, such as less than 3 mm, or more particularly between 0.5and 2.5 mm, or even more particularly between 0.3 and 1.0 mm. Thehousing described herein can also be used for other devices including,but not limited to including, relatively larger form factor electronicdevices (e.g., portable computers, tablet computers, displays, monitors,televisions, etc.). The glass can also be thin in these larger formfactor embodiments, such as less than 5 mm, or more particularly between0.5 and 3 mm, or even more particularly between 0.3 and 2.0 mm.

Embodiments are discussed below with reference to FIGS. 1-7. However,those skilled in the art will readily appreciate that the detaileddescription given herein with respect to these figures is forexplanatory purposes as the invention extends beyond these limitedembodiments.

FIG. 1 a flow diagram of a housing formation process 100 according toone embodiment of the invention. The housing formation process 100 canoperate to produce a housing for an electronic device, or at least aportion of such a housing.

The housing formation process 100 can initially obtain 102 a glassmember. The glass member is to serve as a significant outer surface forthe housing. For example, the glass member can correspond to a topsurface for the housing. Alternatively or additionally, the glass membercan correspond to a bottom surface for the housing. The glass member istypically thin, particularly when used with portable electronic devices.In one embodiment, the glass member has a thickness of less than 5 mm,or more particularly less than 1 mm.

A peripheral metal antenna is also obtained 104. The peripheral metalantenna is typically configured to be placed adjacent a periphery of theglass member. In one embodiment, the peripheral antenna has a“ring-shaped” construction that can be placed adjacent some or all ofthe periphery of the glass member. In one implementation, the peripheralmetal antenna can be formed of sheet metal. In alternativeimplementations, the peripheral metal antenna can be formed of othermetals, such as copper, brass and aluminum.

After the glass member and the peripheral metal antenna have beenobtained, the peripheral metal antenna can be positioned 106 adjacent tothe periphery of the glass member. Typically, the peripheral metalantenna would be positioned 106 and held in such position. To hold theperipheral metal antenna in position, the peripheral media antenna canbe adhered adjacent to the periphery of the glass member by chemicalbonding and/or mechanical structures.

After the peripheral metal antenna has been positioned 106 adjacent tothe glass member, a peripheral protective side portion can be molded 108adjacent to the periphery of the glass member and over at least aportion of the peripheral metal antenna. The peripheral protective sideportion can thus shield (or cover) the peripheral metal antenna, whichcan be advantageous, since the peripheral metal antenna is protected andprovided at an outer region of the housing for the electronic device.The peripheral protective side portion can also serve to provide aprotective covering of the edges of the glass member.

FIG. 2A is a cross-sectional view of an electronic device housing 200according to one embodiment. The electronic device housing 200 is ahousing for an electronic device, such as a compact portable electronicdevice. The electronic device housing 200 includes an outer housingmember 202 supported and protected by a protective side member 204. Theprotective side member 204 being positioned tightly adjacent sides ofthe outer housing member 202. The protective side member 204 can providea thin layer of material positioned tightly adjacent sides of the outerhousing member 202, thereby buffering impact at the sides of the outerhousing member 202.

One or more antenna 206 can be provided within the protective sidemember 204. In this manner, the antenna 206 can be provided at an outerregion of the electronic device housing 200 while also being protectedfrom user interference or damage. Typically, the protective side member204 is also opaque so that users cannot perceive the one or more antenna206 provided within the protective side member 202. The one or moreantenna 206 are used by the electronic device for wirelesscommunications via a wireless network.

Additionally, the one or more antenna 206 can further be used to securethe outer housing member 202 to other portions of the electronic devicehousing 200. In one embodiment, the one or more antenna 206 can besecured to a periphery of an inner surface 208 of the outer housingmember 202. For example, an adhesive 210 can be used to secure the oneor more antenna 206 to the periphery of the inner surface 208 of theouter housing member 202.

The protective side member 204 can also support the outer housing member201 and can serve to secure the outer housing member 202 to otherportions of the electronic device housing 200. In one embodiment, theprotective side member 204 can extend around all sides of the outerhousing member 202. In another embodiment, the protective side member204 can extend around those of the sides of the outer housing member 202that would otherwise be exposed.

As shown in FIG. 2A, the outer housing member 202 can be secured to asupport structure 212 of the electronic device housing 200. The supportstructure 212 can, for example, be an outer periphery member for theelectronic device housing 200. In one embodiment, the support structure212 can couple to another outer housing member 214, which can be formeddifferently than the outer housing member 202.

The protective side member 204 can be secured tightly adjacent the sidesof the outer housing member 202 using an adhesive 208. In oneembodiment, the adhesive 208 can be applied as a layer of adhesive thatis provided around a periphery of an inner side of the outer housingmember 201. The protective side member 202 can be molded in place so asto be tightly adjacent the sides of the outer housing member 202. Bymolding the protective side member 204 in place, the outer exposedinterface 206 between the sides (e.g., edges) of the outer housingmember 202 and the peripheral side member 204 is essentially gap-free.The protective side member 204 can also be molded around the antenna 206secured on the periphery of the bottom side of the outer housing member202. The antenna 206 can thus serve to secure the protective side member204 against the sides of the outer housing member 202. Also, if theadhesive 210 is thermally activated, the molding of the protective sidemember 202 can also serve to activate the thermally activated adhesive210 so that a strong bond can be provided between the outer housingmember 202 and the antenna 210 via the adhesive 210.

An internal space 218 is provided internal to the electronic devicehousing 200 whereby various electrical components can be attached,affixed or placed so as to provide electronic operations for theelectronic device.

The various members, parts or assemblies of the electronic devicehousing 200 can be formed of any of a variety of materials, e.g., glass,polymers or metal. In one embodiment, the outer housing member 202 isglass, the protective side member 204 is be formed from polymer (e.g.,thermoplastic), the support structure 212 is formed from metal orpolymer (e.g., plastic), and the another outer housing member 214 isformed from glass, polymer (e.g., plastic) or metal. More particularly,in some embodiments, the protective side member 204 can be astructurally strengthened polymer (e.g., thermoplastic). As an example,the protective side member 204 can be polymer, such as polyarylamide,nylon or polycarbonate, which can be structurally strengthened byincluding glass fibers. For example, some examples of some structurallystrengthened polymers include 50% glass filled nylon and 30% glassfilled polycarbonate.

FIG. 2B is a cross-sectional assembly diagram for the electronic devicehousing 200 shown in FIG. 2A, according to one embodiment. The outerhousing member 201 has a top surface 214 and a bottom surface 216. Thebottom surface 216 of the outer housing member 201 has adhesive 208applied as a layer of adhesive that is provided around a periphery ofthe bottom surface 216 of the outer housing member 201. The protectiveside member 202 can then be molded adjacent the sides of the outerhousing member 201. When the protective side member 202 is molded, theprotective side member 202 is also at least partially formed adjacentthe adhesive 208 on the bottom surface 216 of the outer housing member.Moreover, when the protective side member 202 is formed, the protectiveside member 202 can also be adjacent and secured to an upper sideportion 218 of the support structure 204. When the protective sidemember 202 are provided at the sides (i.e., edges) of the outer housingmember 201, the protective side member 202 provides a buffer layer(e.g., bumper) that dampens impact induced at the sides of the outerhousing member 201 of the electronic device housing 200.

In FIGS. 2A and 2B, the protective side member (e.g., protective sidebumpers) is a thin layer of material positioned tightly adjacent one ormore sides of the outer housing member, thereby buffering impact at thesides of the outer housing members. The protective side member canrepresent a single structure or a multi-part structure. In oneembodiment, the protective side member is to be strong; hence, astructurally strengthened polymer, such as polyarylamide, can beutilized. The polyarylamide can be strengthened by containing glassfibers. One source of strengthened polyarylamide is IXEF polyarylamide(PARA) from Solvay Advanced Polymers, L.L.C which can contain glassfiber reinforcement. Additionally, since the protective side member aretightly adjacent sides of the outer housing member, the respectivematerials used for the protective side member and the outer housingmember. Specifically, the Coefficient of Thermal Expansion (CTE) of therespective materials, if not controlled, can produce undesired stress onthe sides of the outer housing member. For example, with an outerhousing member of glass, its CTE is about 10 millimeters/meter/° C.Hence, ideally, for this example the CTE of the material for theprotective side member would be about 10 millimeters/meter/° C. Althoughplastics tend to have CTE's (e.g., roughly 100 millimeters/meter/° C.)that are dramatically higher than that of glass, some manufacturedpolymers, such as polyarylamide, can have CTE's (e.g., roughly 30millimeters/meter/° C.) that are substantially closer to that of glassand thereby would, if used, induce less stress on the sides of the outerhousing member. For example, in one embodiment, a manufactured polymerfor such use could have a CTE less than or equal to about 50millimeters/meter/° C., and in another embodiment, a manufacturedpolymer for such use could have a CTE less than or equal to about 35millimeters/meter/° C. Also, as noted above, the thickness of theprotective side member can be thin, for example, the thickness can benot more than about 1 mm in one embodiment.

In still other embodiments, the protective side material can be formedfrom multiple materials that can be alternated, intertwined or layered.The later of material against the edges of the outer housing member ofglass can have a CTE relatively close to that of glass while an outerlayer can have a higher CTE can permit a greater range of material, suchas polymers (e.g., plastics).

The protective side member is able to be thin yet be cosmeticallyunintrusive. For example, in some embodiments, the thickness (t1) forthe protective side member can be less than 1 mm (e.g., 0.8 mm). Also,in some embodiments, the thickness (t2) of the outer housing member canbe less than 5 mm (e.g., 1 mm). However, these thicknesses are exemplaryand vary with the size of the electronic device housing and with desiredstrength. Using a strengthened material for the protective side memberas noted above can also be advantageous. Nevertheless, the provisioningof thin protective side member for outer housing members, such as glasscovers, facilitates providing portable electronic device housings thatare compact and thin yet resistant to side impact damage to the outerhousing members.

FIGS. 3A and 3B are structurally similar to FIGS. 2A and 2B,respectively. However, the configuration of the protective side memberis different. The protective side member illustrated in FIGS. 3A and 3Bform corners for the electronic device housing and, therefore, aretypically thicker than the protective side member illustrated in FIGS.2A and 2B. As an example, in one embodiment, the thickness of theprotective side member is approximately the thickness of the outerhousing member.

FIG. 3A is a cross-sectional view of an electronic device housing 300according to another embodiment. The electronic device housing 300 is ahousing for an electronic device, such as a compact portable electronicdevice. The electronic device housing 300 includes an outer housingmember 302 supported and protected by an interface member 304 having aprotective side member 306 (e.g., protective side bumpers). Theprotective side member 306 can be positioned tightly adjacent sides ofthe outer housing member 302. The protective side member 306 can providea thin layer of material positioned tightly adjacent sides of the outerhousing member 302, thereby buffering impact at the sides of the outerhousing member 302.

One or more antenna 308 can be provided within the protective sidemember 306. In this manner, the antenna 308 can be provided at an outerregion of the electronic device housing 300 while also being protectedfrom user interference or damage. Typically, the protective side member306 is also opaque so that users cannot perceive the one or more antenna308 provided within the protective side member 306. The one or moreantenna 308 are used by the electronic device for wirelesscommunications via a wireless network.

Additionally, the one or more antenna 308 can further be used to securethe outer housing member 302 to other portions of the electronic devicehousing 300. In one embodiment, the one or more antenna 308 can besecured to a periphery of an inner surface 322 of the outer housingmember 302. For example, an adhesive 310 can be used to secure the oneor more antenna 308 to the periphery of the inner surface 322 of theouter housing member 302.

The protective side member 306 can also support the outer housing member302 and can serve to secure the outer housing member 302 to otherportions of the electronic device housing 300. In one embodiment, theprotective side member 306 can extend around all sides of the outerhousing member 302. In another embodiment, the protective side member306 can extend around those of the sides of the outer housing member 302that would otherwise be exposed.

The protective side member 306 can be molded in place so as to betightly adjacent the sides of the outer housing member 302. By moldingthe protective side member 306 in place, an outer exposed interface 317between the sides (e.g., edges) of the outer housing member 302 and theperipheral side member 306 can be essentially gap-free. The protectiveside member 306 can also be molded around the antenna 308 secured on theperiphery of the bottom side of the outer housing member 302. Theantenna 308 can thus serve to secure the protective side member 306against the sides of the outer housing member 302. Also, if the adhesive310 is thermally activated, the molding of the protective side member306 can also serve to activate the thermally activated adhesive 310 sothat a strong bond can be provided between the outer housing member 302and the antenna 308 via the adhesive 310.

In this embodiment, the interface member 304 is secured to an outerperiphery member 314. More particularly, in this embodiment, theinterface member 304 includes securing features 312 (e.g., attachmentarms) that are used to secure the interface member 304 (and thus theouter housing member 302) to the outer periphery member 314. Theelectronic device housing 300 can also include another outer housingmember 316. The another outer housing member 316 can, for example, beintegral with or secured to the outer periphery member 314 on a sideopposite the outer housing member 302. An internal space 318 is providedinternal to the electronic device housing 300 whereby various electricalcomponents can be attached, affixed or placed so as to provideelectronic operations for the electronic device.

The various members, parts or assemblies of the portable electronicdevice 300 can be formed of any of a variety of materials, e.g., glass,polymer or metal. In one embodiment, the outer housing member 302 isglass, the outer periphery member 314 is formed from metal or polymer(e.g., plastic), and the another outer housing member 316 is formed fromglass, polymer (e.g., plastic) or metal. The interface member 304 can beformed of a polymer or from a combination of materials. For example, theprotective side member 306 are to be strong; hence, a structurallystrengthened polymer, such as polyarylamide, can be utilized. Thepolyarylamide can be strengthened by containing glass fibers. Also, asan example, the securing features 312 can be formed from metal forincreased strength. The securing features 312 if formed of metal can becombined with the balance of the interface member 304 by an over-moldingprocess.

FIG. 3B is a cross-sectional assembly diagram for the electronic devicehousing 300 shown in FIG. 3A, according to one embodiment. The outerhousing member 302 has a top surface 320 and a bottom surface 322. Thebottom surface 322 of the outer housing member 302 can be secured to atop surface 324 of the interface member 304. For example, the outerhousing member 302 can be secured to the top surface 324 of theinterface member 304 using adhesive. Typically, the interface member 304is provided adjacent only the peripheral portions of two or more sidesof the outer housing member 302. When the outer housing member 302 issecured to the interface member 304, the protective side member 306 ispositioned at the sides (i.e., edges) of the outer housing member 302.The protective side member 306 provides a buffer layer (e.g., bumper)that dampens impact induced at the sides (e.g., edges) of the outerhousing member 302 of the electronic device housing 300. In addition, abottom surface 326 of the interface member 304 can be secured adjacent atop surface 328 of the outer periphery member 314. The securing features312 of the interface member 304 can be used to secure the interfacemember 304 to the outer periphery member 314.

In FIGS. 3A and 3B, the protective side member 306 (e.g., protectiveside bumpers) is a thin layer of material positioned tightly adjacentone or more sides of the outer housing member 302, thereby bufferingimpact at the sides of the outer housing members. The protective sidemember can represent a single structure or a multi-part structure. Inthese embodiments, the protective side member 306 is rounded at cornersof the electronic device housing 300. For example, in some embodiments,the thickness (t3) for the protective side member 306 can be less than 5mm (e.g., 1 mm). Also, in some embodiments, the thickness (t4) of theouter housing member 392 can be less than 5 mm (e.g., 1 mm). However,these thicknesses are exemplary and vary with the size of the electronicdevice housing and with desired strength. Using a strengthened materialfor the protective side member as noted above can also be advantageous.Nevertheless, the provisioning of thin protective side members for outerhousing members, such as glass covers, facilitates providing portableelectronic device housings that are compact and thin yet resistant toside impact damage to the outer housing members.

In one embodiment, the first outer housing member 301 can represent atop outer surface for the portable electronic device, and the secondouter surface housing 326 can represent a bottom outer surface housing.In one embodiment, both the first outer housing member 301 and thesecond outer housing member 326 are glass (e.g., glass covers).

Although the edges of the outer housing members (201, 226, 301, 326) canbe square as suggested by FIGS. 2A-3B, it should understood that theedges of the outer housing member need not be square but can be formedwith other geometries, such as with chamfered (or flattened) edges orrounded edges. Different embodiments can thus have different edgegeometries for the outer device housing.

The protective side member discussed above is typically a thin layer ofmaterial positioned tightly adjacent sides of the outer housing member,thereby buffering impact at the sides of the outer housing member. Inone embodiment, the protective side member are to be strong; hence, astructurally strengthened polymer, such as polyarylamide, can beutilized. The polyarylamide can be strengthened by containing glassfibers. One source of strengthened polyarylamide is IXEF polyarylamide(PARA) from Solvay Advanced Polymers, L.L.C which can contain glassfiber reinforcement.

Additionally, since the protective side member is tightly adjacent sidesof the outer housing member, the respective materials used for theprotective side member and the outer housing member. Specifically, theCoefficient of Thermal Expansion (CTE) of the respective materials, ifnot controlled, can produce undesired stress on the sides of the outerhousing member. For example, with an outer housing member of glass, itsCTE is about 10 millimeters/meter/° C. Hence, ideally, for this examplethe CTE of the material for the protective side member would be about 10millimeters/meter/° C. Although plastics tend to have CTE's (e.g.,roughly 100 millimeters/meter/° C.) that are dramatically higher thanthat of glass, some manufactured polymers, such as polyarylamide, canhave CTE's (e.g., roughly 30 millimeters/meter/° C.) that aresubstantially closer to that of glass and thereby would, if used, induceless stress on the sides of the outer housing member. For example, inone embodiment, a manufactured polymer for such use could have a CTEless than or equal to about 50 millimeters/meter/° C., and in anotherembodiment, a manufactured polymer for such use could have a CTE lessthan or equal to about 35 millimeters/meter/° C. In one implementation,additive can be added to a polymer so to bring is CTE closer to that ofglass. As examples, the additives can be particles or fibers which canbe formed from glass or ceramic. Also, as noted above, the thickness ofthe protective side member can be thin, for example, the thickness canbe on the order of about 1 mm or less in one embodiment.

In still other embodiments, the protective side material can be formedfrom multiple materials that can be alternated, intertwined or layered.The later of material against the edges of the outer housing member ofglass can have a CTE relatively close to that of glass while an outerlayer can have a higher CTE can permit a greater range of material, suchas polymers (e.g., plastics).

The protective side member is able to be thin yet be cosmeticallyunintrusive. For example, in some embodiments, the thickness (t1) forthe protective side member can be less than 1 mm (e.g., 0.8 mm). Also,in some embodiments, the thickness (t2) of the outer housing member canbe less than 5 mm (e.g., 1 mm). However, these thicknesses are exemplaryand vary with the size of the electronic device housing and with desiredstrength. Using a strengthened material for the protective side memberas noted above can also be advantageous. Nevertheless, the provisioningof thin protective side member for outer housing members, such as glasscovers, facilitates providing portable electronic device housings thatare compact and thin yet resistant to side impact damage to the outerhousing members.

FIG. 4 a flow diagram of a housing formation process 400 according toone embodiment of the invention. The housing formation process 400 canoperate to produce a housing for an electronic device, or at least aportion of such a housing.

The housing formation process 400 can initially obtain 402 an outerhousing member having a top surface and a bottom surface. The topsurface of the outer housing member can correspond to a top surface forthe housing. Typically, the outer housing member serves as a significantouter surface for the housing, such as substantially all of the topsurface of the housing. Alternatively or additionally, the outer housingmember can correspond to a bottom surface for the housing. The outerhousing member is typically thin, particularly when used with portableelectronic devices. In one embodiment, the outer housing member has athickness of less than 5 mm, or more particularly less than 1 mm. In oneembodiment, the outer housing member is transparent and formed of glassor a polymer.

After the outer housing member has been obtained 402, an adhesive layercan be deposited around at least a portion of a periphery of the bottomsurface of the outer housing member. The adhesive can be deposited 404around a periphery of a bottom surface of the outer housing member. Theouter housing member has a top surface that can represent an outersurface for the housing, and a bottom surface that is an inner surfacethat is not exposed. In one embodiment, the adhesive being deposited 404can be a thermally activated adhesive. The adhesive can, for example, byprovided as film or as a layer. Also, the manner by which the adhesiveis deposited can vary. In one implementation, the adhesive can bedeposited 404 by forming a ring-like pattern of adhesive that can beplaced (continuously or discontinuously) around the periphery of thebottom surface of the outer housing member. In another implementation,the adhesive can be screen printed onto the periphery of the bottomsurface of the outer housing member.

Next, a peripheral metal antenna member can be adhered 406 to the outerhousing member using the adhesive layer. Specifically, the peripheralmetal antenna member can be adhered 406 adjacent the bottom surface ofthe outer housing member. The peripheral metal antenna member istypically configured to be placed adjacent a periphery of the outerhousing member. In one embodiment, the peripheral metal antenna memberhas a “ring-shaped” construction that can be placed adjacent some or allof the periphery of the glass member. In one implementation, theperipheral metal antenna member can be formed of sheet metal. Inalternative implementations, the peripheral metal antenna member can beformed of other metals, such as copper, brass and aluminum.

After the peripheral metal antenna member has been adhered 406 adjacentto the outer housing member, a peripheral protective side portion can bemolded 408 adjacent to the periphery of the outer housing member andover at least a portion of the peripheral metal antenna member. Theperipheral protection side portion can thus shield (or cover) theperipheral metal antenna member, which can be advantageous, since theperipheral metal antenna member is protected and provided at an outerregion of the housing for the electronic device. The peripheralprotective side portion can also serve to provide a protective coveringof the edges of the outer housing member.

Typically, the peripheral metal antenna member would be positioned andheld in such position by the adhesive layer. To hold the peripheralmetal antenna member in position, the peripheral media antenna membercan be adhered adjacent to the periphery of the outer housing member bychemical bonding (e.g., adhesive) and/or mechanical structures (e.g.,features of the antenna).

Typically, the peripheral protective side portion would also be securedto the support structure by chemical bonding and/or mechanical features(e.g., undercuts or interlocks). In such case, the outer housing memberand the peripheral protective side portion are secured to the supportstructure and thus form at least a portion of the housing for theelectronic device. Also, if the adhesive is thermally activated, themolding 408 can also serve to activate the thermally activated adhesiveso that a strong bond can be provided to the outer housing member andthe peripheral protective side portion and/or the peripheral metalantenna member.

FIGS. 5A-5D are diagrams illustrating of an outer housing assemblyaccording to one embodiment.

FIG. 5A is a perspective assembly diagram of an outer housing assembly500. As shown in FIG. 5A, an outer housing member 502 provides an outersurface for the outer housing assembly 500. The outer housing member 502is, for example, a glass member that provides a transparent surfacethrough which internal electrical components, such as a display screen,can be viewed through the glass member. The outer housing member 502 isgenerally a thin sheet of material, such as glass or polymer, which isprovided to serve as a portion of an outer surface for an electronicdevice housing. The outer housing member 502 has edges 504.

The backside (or internal side) of the outer housing member 500 can havean adhesive layer 506 applied thereto. The adhesive layer 506 as shownin FIG. 5A is a “ring-shaped” layer that is designed to extend aroundthe periphery of the outer housing member 502. However, it should berecognized that the adhesive layer 516 need not be a continuous layerbut can be isolated or discrete instances of adhesive applied around theperiphery of the backside (or internal side) of the outer housing member502.

Additionally, the outer housing assembly 500 includes an antenna 508that can be secured to the backside of the outer periphery of the outerhousing member 502 by way of the adhesive layer 506. The antenna 508 isan electrically conductive material, such as sheet metal, aluminum,copper, brass and the like. The antenna 508 can extend around the entireperiphery of the outer housing member 502 as illustrated in FIG. 5A.However, it is not necessary that the antenna 508 extend around theentire periphery of the outer housing member 502. It should also benoted that, as illustrated in FIG. 5A, the antenna 508 can include oneor more gaps 510 and 512 (or separation points) that serve toelectrically separate portions of the antenna 508 so as to provide thedesired antenna characteristics. Indeed, the antenna 508 formed aroundthe periphery of the outer housing member 502 can serve to provide aplurality of distinct antenna.

Still further, the outer housing member 500 can include a moldedprotective side portion 514 that can be molded around the edges 504 ofthe outer housing member 502 as well as over at least a portion of theantenna 508. The molded protective side portion 514 can serve to providea protective buffer for the edges 504 of the outer housing member 502.Additionally, the molded protective side portion 514 can further besecure adjacent to the edges 504 of the outer housing member 502 by theadhesive layer 506 and/or the antenna 508.

Although the antenna 508 can include gaps 510 and 512 as shown in FIG.5A, these gaps can be initially connected during assembly to provide theantenna as a unitary structure. For example, the antenna can be formedby stamping process to form a unitary ring-shaped antenna. Then, onceadhered to the outer housing member 502, the gaps 510 and 512 can beopened (or disconnected) so as to provide electrical isolation of thedifferent antenna components (or parts).

FIG. 5B illustrates an outer perspective top view of the outer housingmember 500. The outer perspective top view shown in FIG. 5A illustratesthe outer housing assembly 500 as assembled. The outer housing assembly500, when assembled, includes the outer housing member 502 with themolded protective side portions 514 formed around its outer periphery.The molded protective side portions 514 can be secured to the outerhousing member 502 by way of at least a portion of one or both of theadhesive layer 506 and the antenna 508.

FIG. 5C illustrates an inner perspective top view for the outer housingassembly 500. The outer housing assembly 500, as shown in FIG. 5C,illustrates the outer housing member 502 from a bottom (or inside)surface having the antenna 508 coupled to its backside (or insidesurface). The antenna 508 extends around the periphery of the outerhousing member 502 and is secured thereto by at least a portion of theadhesive layer 506. The molded protective side portion 512 is alsomolded around the periphery of the outer housing member 502. The moldedprotective side portion 512 can also be partially molded over theantenna 508. As a result, the antenna 508 serves to secure the moldedprotective side portion 512 to the edges 504 of the outer housing member502. In addition, the antenna 508 can be securely provided at theperiphery of the outer housing member 502 which serves to provide anantenna at an outer region of an electronic device housing that is usedfor wireless communication. The antenna 508 can also include gaps (orseparations) 510 and 512 as appropriate for the desired antennacharacteristics.

FIG. 5D illustrates an antenna 520 according to one embodiment. Theantenna 520 is a ring-shaped structure that is suitable for use in asimilar manner as is the antenna 508 illustrated in FIGS. 5A-5C.However, in this embodiment, the antenna 520 specifically includes afirst antenna and a second antenna. The first antenna and the secondantenna are separate (or electrically isolated) from one another. Thefirst antenna uses the first portions 522 of the antenna 520 forwireless communications such as with a cellular network. The secondantenna uses a second portion 524 of the antenna 520 short-rangewireless communications, such as Bluetooth or 802.11.

FIGS. 6A-6F are partial cross-sectional views of antenna configurationsaccording to certain embodiments. The antenna configurations can beformed of metal.

FIG. 6A illustrates an antenna configuration 600 that provides a bottomportion 602 and an edge portion 604. The bottom portion 602 can besecured to an outer housing member, and the edge portion 604 can beprovided adjacent the edge of the outer housing member (and within aprotective side member). The antenna configuration 600 is the same orsimilar to the antenna 206 illustrated in FIG. 2A.

FIG. 6B illustrates an antenna configuration 610 that provides a bottomportion 612 and an edge portion 614. The bottom portion 612 can besecured to an outer housing member, and the edge portion 614 can beprovided adjacent the edge of the outer housing member (and within aprotective side member). The edge portion 614 includes at least oneridge 616. When the protective side member is molded around the at leastone ridge 616, the at least one ridge 616 can serve to assist insecuring (e.g., binding) the protective side member to the outer housingmember or, more generally, the electronic device housing.

FIG. 6C illustrates an antenna configuration 620 that provides a bottomportion 622 and an edge portion 624. The bottom portion 622 can besecured to an outer housing member, and the edge portion 624 can beprovided adjacent the edge of the outer housing member (and within aprotective side member). The edge portion 624 includes at least onenotch 626. When the protective side member is molded around the at leastone notch 626, the at least one notch 626 can serve to assist insecuring (e.g., binding) the protective side member to the outer housingmember or, more generally, the electronic device housing.

FIG. 6D illustrates an antenna configuration 630 that provides a bottomportion 632 and an edge portion 634. The bottom portion 632 can besecured to an outer housing member, and the edge portion 634 can beprovided adjacent the edge of the outer housing member (and within aprotective side member). The edge portion 634 includes at least oneopening 636. When the protective side member is molded around the atleast one opening 636, the at least one opening 636 can serve to assistin securing (e.g., binding) the protective side member to the outerhousing member or, more generally, the electronic device housing.

FIG. 6E illustrates an antenna configuration 640 that provides a bottomportion 642 and an edge portion 644. The bottom portion 642 can besecured to an outer housing member, and the edge portion 644 can beprovided adjacent the edge of the outer housing member (and within aprotective side member). The edge portion 644 includes at least one hook646. When the protective side member is molded around the at least onehook 646, the at least one hook 646 can serve to assist in securing(e.g., binding) the protective side member to the outer housing memberor, more generally, the electronic device housing.

FIG. 6F illustrates an antenna configuration 650 that provides a bottomportion 652 and an edge portion 654. The bottom portion 652 can besecured to an outer housing member, and the edge portion 654 can beprovided adjacent the edge of the outer housing member (and within aprotective side member). The antenna configuration 650 can also includean attachment member 656 (e.g., tab) that facilitates attachment of theantenna configuration 650 to other portions (e.g., support structure212) of the electronic device housing. The antenna configuration 650 issimilar to the antenna 206 illustrated in FIG. 2A except for theadditional attachment member 656.

FIG. 7 is a cross-sectional view of an electronic device housing 200′according to another embodiment. The electronic device housing 200′ is ahousing for an electronic device, such as a compact portable electronicdevice. The electronic device housing 200′ is generally similar to theelectronic device housing 200. The electronic device housing 200′illustrated in FIG. 7, however, further illustrates an electronicsubstrate 700 (e.g., printed circuit board or flex circuit) within theinternal space 218. A plurality of electrical components 702 (e.g.,integrated circuits, electronic components, etc.) are attached to theelectronic substrate 700. In addition, an antenna 206′ can be providedand can be similar to the antenna 206 discussed above regarding FIG. 2A;however, the antenna 206′ includes an extended internal member 706. Aconnector 706 or other electrically conductive component canelectrically connect the extended internal member 706 of the antenna206′ to the electronic substrate 700. The connector 706 can be securedto the electronic substrate 700 and/or the extended internal member 706,such as with adhesive, solder or other attachment mechanisms.Alternatively, the connector 706 can be biased against the electronicsubstrate 700 and/or the extended internal member 706, such as with aspring-biased pin.

Additional details on electronic device housings using side protectivemembers, outer housing members (e.g., glass members) and/or insertmolding are contained in: (i) U.S. application Ser. No. 12/794,563,filed Jun. 4, 2010, and entitled “Offset Control for Assembling AnElectronic Device Housing,” which is hereby incorporated herein byreference; (ii) U.S. application Ser. No. 12/895,822, filed Sep. 30,2010, and entitled “Insert Molded Device Housings for PortableElectronic Devices,” which is hereby incorporated herein by reference;(iii) U.S. application Ser. No. 12/944,671, filed Nov. 11, 2010, andentitled “Insert Molding Around Glass Members for Portable ElectronicDevices,” which is hereby incorporated herein by reference; (iv) U.S.application Ser. No. ______, filed concurrently, and entitled “Housingfor Portable Electronic Device with Reduced Border Region,” which ishereby incorporated herein by reference; and (v) U.S. application Ser.No. ______, filed concurrently, and entitled “Housing for PortableElectronic Device with Reduced Border Region,” which is herebyincorporated herein by reference.

In general, the steps associated with the methods of the presentinvention may vary widely. Steps may be added, removed, altered,combined, and reordered without departing from the spirit or the scopeof the present invention.

The various aspects, features, embodiments or implementations of theinvention described above may be used alone or in various combinations.

While this specification contains many specifics, these should not beconstrued as limitations on the scope of the disclosure or of what maybe claimed, but rather as descriptions of features specific toparticular embodiment of the disclosure. Certain features that aredescribed in the context of separate embodiments may also be implementedin combination. Conversely, various features that are described in thecontext of a single embodiment may also be implemented in multipleembodiments separately or in any suitable subcombination. Moreover,although features may be described above as acting in certaincombinations, one or more features from a claimed combination can insome cases be excised from the combination, and the claimed combinationmay be directed to a subcombination or variation of a subcombination.

While embodiments and applications have been shown and described, itwould be apparent to those skilled in the art having the benefit of thisdisclosure that many more modifications than mentioned above arepossible without departing from the inventive concepts herein.

What is claimed is:
 1. An electronic device enclosure for an electronicdevice, comprising: a glass cover for an outer surface for theelectronic device enclosure; at least one peripheral metal antennaprovided adjacent a periphery of the glass cover; and a peripheral sideprotective surface for the glass cover, the peripheral side protectivesurface being provided adjacent to the periphery of the glass cover andover at least a portion of the at least one peripheral metal antenna,wherein the peripheral side protective surface is molded about theperiphery of the glass cover and molded over at least a portion of theat least one peripheral metal antenna.
 2. An electronic device enclosureas recited in claim 1, wherein the at least one peripheral metal antennais at least partially secured to the glass cover by an adhesive.
 3. Anelectronic device enclosure as recited in claim 2, wherein the adhesiveis deposited at a periphery of the glass cover between the glass coverand the at least one peripheral metal antenna.
 4. An electronic deviceenclosure as recited in claim 1, wherein the adhesive is deposited onthe bottom surface of the glass cover, and wherein a portion of the atleast one peripheral metal antenna is provided over the bottom surfaceand is secured to the glass cover via the adhesive.
 5. An electronicdevice enclosure as recited in claim 1, wherein the at least oneperipheral metal antenna comprises a plurality of separate metal pieces.6. An electronic device enclosure as recited in claim 1, wherein theperipheral side protective surface comprises a polymer.
 7. An electronicdevice enclosure as recited in claim 1, wherein the peripheral sideprotective surface comprises a polymer strengthened by containing glassfibers.
 8. An electronic device enclosure as recited in claim 1, whereinthe peripheral side protective surface comprises a polymer, and whereinthe polymer includes additives such that the CTE of the peripheralstructure is made closer to the CTE of the glass cover.
 9. An electronicdevice enclosure as recited in claim 8, wherein the additives compriseparticles or fibers made of glass or ceramic.
 10. An electronic deviceenclosure as recited in claim 1, wherein the thickness of the glasscover window is about 0.3-1.0 mm.
 11. An electronic device enclosure asrecited in claim 1, wherein the electronic device is a portableelectronic device.
 12. An electronic device enclosure as recited inclaim 1, wherein the electronic device is a hand-held electronic device.13. An electronic device enclosure as recited in claim 1, wherein theelectronic device enclosure further comprises a support structure, andwherein the peripheral side protective surface is provided adjacent tothe support structure.
 14. An electronic device enclosure as recited inclaim 13, wherein the at least one peripheral metal antenna has at leastone feature that provides a mechanical interlock with the peripheralside protective surface after the peripheral side protective surface hasbeen molded.
 15. An electronic device enclosure as recited in claim 1,wherein the at least one peripheral metal antenna includes an innerportion and an outer portion, wherein the inner portion is attached tothe glass cover via an adhesive, and wherein the peripheral sideprotective surface is molded over at least the outer portion. 16-27.(canceled)